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| TC1054/TC1055/TC1186 50 mA, 100 mA and 150 mA CMOS LDOs with Shutdown and ERROR Output Features * Low Ground Current for Longer Battery Life * Low Dropout Voltage * Choice of 50 mA (TC1054), 100 mA (TC1055) and 150 mA (TC1186) Output * High Output Voltage Accuracy * Standard or Custom Output Voltages: - 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V * Power-Saving Shutdown Mode * ERROR Output Can Be Used as a Low Battery Detector or Microcontroller Reset Generator * Overcurrent and Overtemperature Protection * 5-Pin SOT-23 Package * Pin Compatible Upgrades for Bipolar Regulators General Description The TC1054, TC1055 and TC1186 are high accuracy (typically 0.5%) CMOS upgrades for older (bipolar) low dropout regulators. Designed specifically for battery-operated systems, the devices' CMOS construction minimizes ground current, extending battery life. Total supply current is typically 50 A at full load (20 to 60 times lower than in bipolar regulators). The devices' key features include low noise operation, low dropout voltage - typically 85 mV (TC1054), 180 mV (TC1055) and 270 mV (TC1186) at full load -- and fast response to step changes in load. An error output (ERROR) is asserted when the devices are outof-regulation (due to a low input voltage or excessive output current). ERROR can be used as a low battery warning or as a processor RESET signal (with the addition of an external RC network). Supply current is reduced to 0.5 A (max), with both VOUT and ERROR disabled when the shutdown input is low. The devices incorporate both over-temperature and over-current protection. The TC1054, TC1055 and TC1186 are stable with an output capacitor of only 1 F and have a maximum output current of 50 mA, 100 mA and 150 mA, respectively. For higher output current regulators, please refer to the TC1173 (IOUT = 300 mA) data sheet (DS21632). Applications * * * * * * * Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers Typical Application 1 5 + 1 F Package Type 5-Pin SOT-23 VOUT 5 TC1054 TC1055 TC1186 ERROR VIN VIN VOUT VOUT ERROR 4 2 GND TC1054 TC1055 TC1186 1 M 3 SHDN ERROR 4 1 VIN 2 GND 3 SHDN NOTE: 5-Pin SOT-23 is equivalent to the EIAJ (SC-74A) Shutdown Control (from Power Control Logic) (c) 2007 Microchip Technology Inc. DS21350D-page 1 TC1054/TC1055/TC1186 1.0 ELECTRICAL CHARACTERISTICS Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings Input Voltage ....................................................................6.5V Output Voltage .....................................(-0.3V) to (VIN + 0.3V) Power Dissipation ......................... Internally Limited (Note 6) Maximum Voltage on Any Pin ...................VIN +0.3V to -0.3V Operating Junction Temperature Range .. -40C < TJ < 125C Storage Temperature.....................................-65C to +150C DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VIN = VOUT + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. Boldface type specifications apply for junction temperatures of -40C to +125C. Parameters Input Operating Voltage Maximum Output Current Sym VIN IOUTMAX Min 2.7 50 100 150 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ -- -- -- -- 20 40 0.05 0.5 0.5 2 65 85 180 270 50 0.05 64 300 0.04 160 10 Max 6.0 -- -- -- -- -- 0.35 2 3 -- -- 120 250 400 80 0.5 -- 450 -- -- -- Units V mA Note 8 TC1054 TC1055 TC1186 Note 1 Conditions Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation: TC1054; TC1055 TC1186 Dropout Voltage: VOUT TCVOUT VOUT/VIN VOUT/VOUT VR - 2.5% VR 0.5% VR + 2.5% V ppm/C Note 2 % % mV (VR + 1V) VIN 6V (Note 3) IL = 0.1 mA to IOUTMAX IL = 0.1 mA to IOUTMAX IL = 100 A IL = 20 mA IL = 50 mA IL = 100 mA IL = 150 mA (Note 4) SHDN = VIH, IL = 0 A (Note 9) SHDN = 0V f 1 kHz VOUT = 0V Notes 5, 6 VIN-VOUT TC1055; TC1186 TC1186 Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Thermal Shutdown Die Temperature Thermal Shutdown Hysteresis IIN IINSD PSRR IOUTSC VOUT/PD TSD TSD A A dB mA V/W C C Note 1: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V. 2: TC VOUT = (VOUTMAX - VOUTMIN)x 106 VOUT x T 3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. 5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 "Thermal Considerations", "Thermal Considerations", for more details. 7: Hysteresis voltage is referenced by VR. 8: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. 9: Apply for junction temperatures of -40C to +85C. DS21350D-page 2 (c) 2007 Microchip Technology Inc. TC1054/TC1055/TC1186 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = VOUT + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. Boldface type specifications apply for junction temperatures of -40C to +125C. Parameters Output Noise SHDN Input SHDN Input High Threshold SHDN Input Low Threshold ERROR Output Minimum VIN Operating Voltage Output Logic Low Voltage ERROR Threshold Voltage ERROR Positive Hysteresis VOUT to ERROR Delay VINMIN VOL VTH VHYS tDELAY 1.0 -- -- -- -- -- -- 0.95 x VR 50 2.5 -- 400 -- -- -- V mV V mV ms 1 mA Flows to ERROR See Figure 4-2 Note 7 VOUT falling from VR to VR - 10% VIH VIL 45 -- -- -- -- 15 %VIN %VIN VIN = 2.5V to 6.5V VIN = 2.5V to 6.5V Sym eN Min -- Typ 260 Max -- Units Conditions nV/Hz IL = IOUTMAX Note 1: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V. 2: TC VOUT = (VOUTMAX - VOUTMIN)x 106 VOUT x T 3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. 5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 "Thermal Considerations", "Thermal Considerations", for more details. 7: Hysteresis voltage is referenced by VR. 8: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. 9: Apply for junction temperatures of -40C to +85C. (c) 2007 Microchip Technology Inc. DS21350D-page 3 TC1054/TC1055/TC1186 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = VOUT + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. 0.020 0.018 0.100 ILOAD = 10 mA DROPOUT VOLTAGE (V) 0.090 0.080 0.070 0.060 0.050 0.040 0.030 0.020 0.010 0.000 0 20 50 TEMPERATURE (C) 70 125 ILOAD = 50 mA DROPOUT VOLTAGE (V) 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0.000 -40 -20 CIN = 1 F COUT = 1 F CIN = 1 F COUT = 1 F -40 -20 0 20 50 TEMPERATURE (C) 70 125 FIGURE 2-1: Dropout Voltage vs. Temperature (ILOAD = 10 mA). 0.200 0.180 DROPOUT VOLTAGE (V) FIGURE 2-4: Dropout Voltage vs. Temperature (ILOAD = 50 mA). 0.300 ILOAD = 100 mA ILOAD = 150 mA DROPOUT VOLTAGE (V) 0.250 0.200 0.150 0.100 0.050 0.000 0.160 0.140 0.120 0.100 0.080 0.060 0.040 0.020 0.000 -40 -20 0 20 50 70 125 CIN = 1 F COUT = 1 F CIN = 1 F COUT = 1 F -40 -20 0 20 50 TEMPERATURE (C) 70 125 TEMPERATURE (C) FIGURE 2-2: Dropout Voltage vs. Temperature (ILOAD = 100 mA). 90 80 FIGURE 2-5: Dropout Voltage vs. Temperature (ILOAD = 150 mA). 90 ILOAD = 10 mA GND CURRENT (A) 80 70 60 50 40 30 20 10 0 ILOAD = 100 mA GND CURRENT (A) 70 60 50 40 30 20 10 0 CIN = 1 F COUT = 1 F 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) CIN = 1 F COUT = 1 F 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) FIGURE 2-3: (ILOAD = 10 mA). Ground Current vs. VIN FIGURE 2-6: (ILOAD = 100 mA). Ground Current vs. VIN DS21350D-page 4 (c) 2007 Microchip Technology Inc. TC1054/TC1055/TC1186 Note: Unless otherwise indicated, VIN = VOUT + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. 80 70 GND CURRENT (A) 3.5 ILOAD = 150 mA ILOAD = 0 3 2.5 60 VOUT (V) 50 40 30 20 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) 2 1.5 1 CIN = 1 F COUT = 1 F 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 CIN = 1 F COUT = 1 F 5.5 6 6.5 7 VIN (V) FIGURE 2-7: (ILOAD = 150 mA). 3.5 3.0 2.5 VOUT (V) Ground Current vs. VIN FIGURE 2-10: (ILOAD = 0 mA). 3.320 VOUT vs. VIN ILOAD = 100 mA 3.315 3.310 3.305 ILOAD = 10 mA 2.0 1.5 1.0 0.5 0.0 0 VOUT (V) 3.300 3.295 3.290 3.285 CIN = 1 F COUT = 1 F 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 VIN (V) 3.280 3.275 -40 CIN = 1 F COUT = 1 F VIN = 4.3V -20 -10 0 20 40 85 125 TEMPERATURE (C) FIGURE 2-8: (ILOAD = 100 mA). 3.290 3.288 3.286 VOUT vs. VIN FIGURE 2-11: Output Voltage (3.3V) vs. Temperature (ILOAD = 10 mA). 5.025 5.020 5.015 ILOAD = 150 mA ILOAD = 10 mA VOUT (V) 3.282 3.280 3.278 3.276 3.274 -40 -20 -10 0 20 40 85 125 VOUT (V) 3.284 5.010 5.005 5.000 4.995 4.990 4.985 CIN = 1 F COUT = 1 F VIN = 4.3V VIN = 6V CIN = 1 F COUT = 1 F -40 -20 -10 0 20 40 85 125 TEMPERATURE (C) TEMPERATURE (C) FIGURE 2-9: (ILOAD = 150 mA). VOUT vs. VIN FIGURE 2-12: Output Voltage (5V) vs. Temperature (ILOAD = 10 mA). (c) 2007 Microchip Technology Inc. DS21350D-page 5 TC1054/TC1055/TC1186 Note: Unless otherwise indicated, VIN = VOUT + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. 10.0 RLOAD = 50 COUT = 1 F CIN = 1 F 4.994 4.992 4.990 4.988 ILOAD = 150 mA NOISE (V/Hz) 1.0 VOUT (V) 4.986 4.984 4.982 4.980 4.978 4.976 4.974 -40 -20 -10 0 20 40 85 125 VIN = 6V CIN = 1 F COUT = 1 F 0.1 TEMPERATURE (C) 0.0 0.01K 0.1K 1K 10K 100K 1000K FREQUENCY (Hz) FIGURE 2-13: Output Voltage (5V) vs. Temperature (ILOAD = 10 mA). 70 60 FIGURE 2-16: Output Noise vs. Frequency. 1000 COUT = 1 F to 10 F ILOAD = 10 mA 100 COUT ESR () 10 1 Stable Region GND CURRENT (A) 50 40 30 20 10 0 -40 -20 -10 0 20 40 TEMPERATURE (C) 85 125 VIN = 6V CIN = 1 F COUT = 1 F 0.1 0.01 0 10 20 30 40 50 60 70 80 90 100 LOAD CURRENT (mA) FIGURE 2-14: GND Current vs. Temperature (ILOAD = 10 mA). 80 70 GND CURRENT (A) FIGURE 2-17: Current. Stability Region vs. Load ILOAD = 150 mA VSHDN 60 50 40 30 20 10 0 -40 -20 -10 0 20 40 85 125 TEMPERATURE (C) VIN = 6V CIN = 1 F COUT = 1 F VOUT FIGURE 2-15: GND Current vs. Temperature (ILOAD = 150 mA). Conditions: CIN = 1 F, COUT = 1 F, ILOAD = 100 mA, VIN = 4.3V, Temp = +25C, Fall Time = 184 s FIGURE 2-18: LDO. Measure Rise Time of 3.3V DS21350D-page 6 (c) 2007 Microchip Technology Inc. TC1054/TC1055/TC1186 Note: Unless otherwise indicated, VIN = VOUT + 1V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. VSHDN VSHDN VOUT VOUT Conditions: CIN = 1 F, COUT = 1 F, ILOAD = 100 mA, VIN = 6V, Temp = +25C, Fall Time = 192 s Conditions: CIN = 1 F, COUT = 1 F, ILOAD = 100 mA, VIN = 4.3V, Temp = +25C, Fall Time = 52 s FIGURE 2-19: LDO. Measure Rise Time of 5.0V FIGURE 2-21: LDO. Measure Fall Time of 3.3V VSHDN VOUT VOUT Conditions: VIN = 6V, CIN = 0 F, COUT = 1 F ILOAD was increased until temperature of die reached about 160C, at which time integrated thermal protection circuitry shuts the regulator off when die temperature exceeds approximately 160C. The regulator remains off until die temperature drops to approximately 150C. Conditions: CIN = 1 F, COUT = 1 F, ILOAD = 100 mA, VIN = 6V, Temp = +25C, Fall Time = 88 s FIGURE 2-22: LDO. Measure Fall Time of 5.0V FIGURE 2-20: Thermal Shutdown Response of 5.0V LDO. (c) 2007 Microchip Technology Inc. DS21350D-page 7 TC1054/TC1055/TC1186 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin No. 1 2 3 4 5 PIN FUNCTION TABLE Symbol VIN GND SHDN ERROR VOUT Unregulated supply input Ground terminal Shutdown control input Out-of-Regulation Flag (Open-drain output) Regulated voltage output Description 3.1 Unregulated Supply Input (VIN) 3.3 Shutdown Control Input (SHDN) Connect unregulated input supply to the VIN pin. If there is a large distance between the input supply and the LDO regulator, some input capacitance is necessary for proper operation. A 1 F capacitor connected from VIN to ground is recommended for most applications. The regulator is fully enabled when a logic-high is applied to SHDN. The regulator enters shutdown when a logic-low is applied to SHDN. During shutdown, output voltage falls to zero, ERROR is open-circuited and supply current is reduced to 0.5 A (max). 3.2 Ground Terminal (GND) 3.4 Out Of Regulation Flag (ERROR) Connect the unregulated input supply ground return to GND. Also connect the negative side of the 1 F typical input decoupling capacitor close to GND and the negative side of the output capacitor COUT to GND. ERROR goes low when VOUT is out-of-tolerance by approximately -5%. 3.5 Regulated Voltage Output (VOUT) Connect the output load to VOUT of the LDO. Also connect the positive side of the LDO output capacitor as close as possible to the VOUT pin. DS21350D-page 8 (c) 2007 Microchip Technology Inc. TC1054/TC1055/TC1186 4.0 DETAILED DESCRIPTION 4.1 ERROR Open-Drain Output The TC1054, TC1055 and TC1186 are precision fixed output voltage regulators (If an adjustable version is desired, please see the TC1070/TC1071/TC1187 data sheet (DS21353)). Unlike bipolar regulators, the TC1054, TC1055 and TC1186 supply current does not increase with load current. Figure 4-1 shows a typical application circuit, where the regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05 A (typical), VOUT falls to zero volts, and ERROR is opencircuited. ERROR is driven low whenever VOUT falls out of regulation by more than -5% (typical). This condition may be caused by low input voltage, output current limiting or thermal limiting. The ERROR threshold is 5% below rated VOUT, regardless of the programmed output voltage value (e.g. ERROR = VOL at 4.75V (typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V regulator). ERROR output operation is shown in Figure 4-2. Note that ERROR is active when VOUT falls to VTH and inactive when VOUT rises above VTH by VHYS. As shown in Figure 4-1, ERROR can be used either as a battery low flag or as a processor RESET signal (with the addition of timing capacitor C2). R1 x C2 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200 ms to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V). + + 1 F VIN VOUT +1 F C1 VOUT Battery TC1054 TC1055 TC1186 GND VOUT VTH V+ HYSTERESIS (VH) SHDN ERROR Shutdown Control (to CMOS Logic or Tie to VIN if unused) R1 1MW 0.2 F C2 BATTLOW or RESET ERROR VIH VOL tDELAY C2 Required Only if ERROR is used as a Processor RESET Signal (See Text) FIGURE 4-2: FIGURE 4-1: Typical Application Circuit. Error Output Operation. 4.2 Output Capacitor A 1 F (minimum) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1 and less than 5.0, with a resonant frequency above 1 MHz. A 1 F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C.). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. (c) 2007 Microchip Technology Inc. DS21350D-page 9 TC1054/TC1055/TC1186 5.0 5.1 THERMAL CONSIDERATIONS Thermal Shutdown Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX VOUTMIN ILOADMAX TJMAX TAMAX Find: = 3.0V +5% = 2.7V - 2.5% = 40 mA = +125C = +55C 1. 2. Actual power dissipation Maximum allowable dissipation Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator remains off until the die temperature drops to approximately 150C. 5.2 Power Dissipation The amount of power the regulator dissipates is primarily a function of input voltage, output voltage and output current. The following equation is used to calculate worst case actual power dissipation: EQUATION 5-1: P D ( V INMAX - V OUTMIN )I LOADMAX Where: PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current Actual power dissipation: P D ( V INMAX - V OUTMIN )I LOADMAX = [ ( 3.0 x 1.05 ) - ( 2.7 x 0.975 ) ]40 x 10 = 20.7mW Maximum allowable power dissipation: ( T JMAX - T AMAX ) P DMAX = ------------------------------------------ JA = ( 125 - 55 ) ------------------------220 = 318mW In this example, the TC1054 dissipates a maximum of 20.7 mW; below the allowable limit of 318 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. -3 The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA). The 5-Pin SOT-23 package has a JA of approximately 220C/Watt. EQUATION 5-2: ( T JMAX - T AMAX ) P DMAX = ------------------------------------------ JA Where all terms are previously defined. 5.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads and wide power supply bus lines combine to lower JA and, therefore, increase the maximum allowable power dissipation limit. DS21350D-page 10 (c) 2007 Microchip Technology Inc. TC1054/TC1055/TC1186 6.0 6.1 PACKAGING INFORMATION Package Marking Information 5-Pin SOT-23 5 4 12 34 1 2 3 1 & 2 represents part number code + temperature range and voltage TC1054 Code CY C1 CT C2 CZ C8 C3 C4 C9 C0 C6 TC1055 Code DY D1 DT D2 DZ D8 D3 D4 D9 D0 D6 TC1186 Code PY P1 PV P2 PZ P8 P3 P5 P9 P0 P7 (V) 1.8 2.5 2.6 2.7 2.8 2.85 3.0 3.3 3.6 4.0 5.0 3 4 represents year and quarter code represents lot ID number (c) 2007 Microchip Technology Inc. DS21350D-page 11 TC1054/TC1055/TC1186 5-Lead Plastic Small Outline Transistor (OT) [SOT-23] CT Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging b N E E1 1 e 2 3 e1 D A A2 c A1 L L1 Units Dimension Limits Number of Pins Lead Pitch Outside Lead Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness N e e1 A A2 A1 E E1 D L L1 c 0.90 0.89 0.00 2.20 1.30 2.70 0.10 0.35 0 0.08 MIN MILLIMETERS NOM 5 0.95 BSC 1.90 BSC - - - - - - - - - - 1.45 1.30 0.15 3.20 1.80 3.10 0.60 0.80 30 0.26 MAX Lead Width b 0.20 - 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-091B DS21350D-page 12 (c) 2007 Microchip Technology Inc. TC1054/TC1055/TC1186 APPENDIX A: REVISION HISTORY Revision D (February 2007) * Corrected standard output voltages on page 1 and in "Product Identification System". * Added TDELAY parameter in DC Characteristics table in "Electrical Characteristics". * Changes to Figure 4-2. * "Packaging Information": Corrected SOT-23 Packaging Informaton. Revision C (March 2003) * Undocumented changes. Revision B (May 2002) * Undocumented changes. Revision A (March 2002) * Original Release of this Document. (c) 2007 Microchip Technology Inc. DS21350D-page 13 TC1054/TC1055/TC1186 NOTES: DS21350D-page 14 (c) 2007 Microchip Technology Inc. TC1054/TC1055/TC1186 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X.X Output Voltage X Temperature Range XXXXX Package Examples: a) b) c) d) e) f) g) h) i) j) k) a) b) c) d) e) f) g) h) i) j) k) a) b) c) d) e) f) g) h) i) j) k) TC1054-1.8VCT713: 1.8V LDO Regulator TC1054-2.5VCT713: 2.5V LDO Regulator TC1054-2.6VCT713: 2.6V LDO Regulator TC1054-2.7VCT713: 2.7V LDO Regulator TC1054-2.8VCT713: 2.8V LDO Regulator TC1054-2.85VCT713: 2.85V LDO Regulator TC1054-3.0VCT713: 3.0V LDO Regulator TC1054-3.3VCT713: 3.3V LDO Regulator TC1054-3.6VCT713: 3.6V LDO Regulator TC1054-4.0VCT713: 4.0V LDO Regulator TC1054-5.0VCT713: 5.0V LDO Regulator TC1055-1.8VCT713: 1.8V LDO Regulator TC1055-2.5VCT713: 2.5V LDO Regulator TC1055-2.6VCT713: 2.6V LDO Regulator TC1055-2.7VCT713: 2.7V LDO Regulator TC1055-2.8VCT713: 2.8V LDO Regulator TC1055-2.85VCT713: 2.85V LDO Regulator TC1055-3.0VCT713: 3.0V LDO Regulator TC1055-3.3VCT713: 3.3V LDO Regulator TC1055-3.6VCT713: 3.6V LDO Regulator TC1055-4.0VCT713: 4.0V LDO Regulator TC1055-5.0VCT713: 5.0V LDO Regulator TC1186-1.8VCT713: 1.8V LDO Regulator TC1186-2.5VCT713: 2.5V LDO Regulator TC1186-2.6VCT713: 2.6V LDO Regulator TC1186-2.7VCT713: 2.7V LDO Regulator TC1186-2.8VCT713: 2.8V LDO Regulator TC1186-2.85VCT713: 2.85V LDO Regulator TC1186-3.0VCT713: 3.0V LDO Regulator TC1186-3.3VCT713: 3.3V LDO Regulator TC1186-3.6VCT713: 3.6V LDO Regulator TC1186-4.0VCT713: 4.0V LDO Regulator TC1186-5.0VCT713: 5.0V LDO Regulator Device: TC1054: TC1055: TC1186: 50 mA LDO with Shutdown & Error output 100 mA LDO with Shutdown & Error output 150 mA LDO with Shutdown & Error output Output Voltage *: 1.8 = 1.8V "Standard" 2.5 = 2.5V "Standard" 2.6 = 2.6V "Standard" 2.7 = 2.7V "Standard" 2.8 = 2.8V "Standard" 2.85 = 2.85V "Standard" 3.0 = 3.0V "Standard" 3.3 = 3.3V "Standard" 3.6 = 3.6V "Standard" 4.0 = 4.0V "Standard" 5.0 = 5.0V "Standard" *Contact factory for other output voltage options. V = -40C to +125C Temperature Range: Package: CT713 = 5L SOT-23, Tape and Reel (c) 2007 Microchip Technology Inc. DS21350D-page 15 TC1054/TC1055/TC1186 NOTES: DS21350D-page 16 (c) 2007 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2007 Microchip Technology Inc. DS21350D-page 17 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256 ASIA/PACIFIC India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 12/08/06 DS21350D-page 18 (c) 2007 Microchip Technology Inc. |
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